Duplex Laser Soldering Ball Machine Automatic System Duplex Laser Soldering Ball Machine
Parameter fabrica
tem | valorem |
Type | Machina venditionis |
Conditio | New |
Lorem Industria | fuse industria, semiconductor industria, communicationis industria |
Apparatus Test Report | dummodo |
Marketing Type | Ordinarius Product |
Warranty of core components | 1.5 Annos |
Core Components | PLC, Motor, vas pressum |
Showroom Location | Nullus |
Locus Origin | China |
Guangdong | |
Nomen notam | UF |
Voltage | 220V |
Dimensiones | 100* 110* 165(cm) |
Usage | solidatorium filum |
Warranty | 3Years |
Key Points scelerisque | Summus diligentia |
Pondus (KG) | 500KG |
Exemplar | LAB201 |
Specificationes pila soldum | 0.15-0.25mm/0.3-0.76mm/0.9-2.0mm (Libitum) |
Visual positioning system | CCD, Resolutio±5um |
Camera elementa | V decies elementa |
Imperium modus | PLC+PC Control |
Mechanica repeatability accuracy | ±0.0mm |
Processus range | 200mm * 150mm (Mos) |
utere potestate | <2KW/H |
Aeris fons | Aer compressus>0.5 MPa nitrogenium>0.5MPa |
Exteriore (LW* H) | 1000*1100*1650(mm) |
Device features
1. Processus calefactionis et guttae celere est et intra 0.2s perfici potest;
2. Perfice liquefactionem pilae solidatoris in COLLUM solidatoris sine sonantis;
3. nulla fluxus, nulla inquinatio, ad vitam electronicarum machinarum maximize;
4. Diameter minimum pilae solidae est 0,15 mm, quae in linea cum evolutione trendof integrationis et praecisiones habet;
5. Welding de diversis articulis solidaribus per electionem pilae solidae magnitudine perfici possunt;
6. Stabilis glutino qualitas et princeps cede rate.
7. Cooperare cum CCD systematis positionis ad occurrendum necessitatibus occurrentibus in mole productionis rectae congregationis;
8. UPH > puncta 8000, cedunt > 99% (diversa secundum diversum productum )
Applicationem agri
CCM camera/module, digitus auri/FPC, filum, communicationis fabrica, optica fabrica, fuse industria, semiconductor industria solida.
Applicationem dolor
Globus laser solidaris subtilitatem conglutinationis cognoscit classis: PCB codex et auri digitus solidarius nexus, FPC et PCB glutino, virga filum ac
PCB glutino, pars THT obturaculum-in fabrica solidandi. Producta cum PIN paxillos ex una parte et contralata producta cum PIN paxillos in utroque
latera, et alia multa subtilissime glutino producta.